Infineon Technologies

Your Role

Key responsibilities in your new role

• Package Requirements Understanding: Understand the criteria in a package, electrically, structurally, quality standard governing the application.
• Data Analysis: Conduct in-depth analysis of large and complex datasets to extract meaningful package concept in technology & assembly for decision-making.
• Data Collection & Organization: Collect, clean, and organize data from various sources for analysis.
• Dashboard Development: Work on a dashboard for package selection.
• App Development: Build a handphone app for package info retrieval.

Internship Learning Outcomes:

• Advanced Packaging Concepts: Concept and design of advanced packaging in specific automotive solutions.
• End-to-End Product Exposure: Experience the fast pace and dynamic conceptualisation of a package from design to ramp up phase.
• Global Team Collaboration: Exposure to various expert team and the team work to realise a final product in a global setting.
• Career Preparation: Integrate into new package design and launch in the competitive packaging assembly environment.

Your Profile

Qualifications and skills to help you succeed

• Education: Bachelor's/ Masters' pursuing engineering studies.
• Semiconductor Fundamentals: Basic technical understanding of semiconductor material / process / technology.
• Analytical Capability: Experience with complex dataset, with good analytical mindset.
• Digital/Programming Exposure: Academic exposure in AI, digitalisation or programming languages (preferred).
• Initiative & Adaptability: Able to handle changes, take initiative to make solution proposal.
• Self-Management: Self motivated, highly organised, able to manage task independently.
• Preferred Intake: Jan 27 – May/June 27.